XSCAN-9850 Flip Chip In-Line Inspection ( Patent Applicant)

XSCAN-9850 Flip Chip In-Line Inspection ( Patent Applicant) Product Introduction The XSCAN-9850 X-ray in-line device is a high tech product that tests the welding state between the flip chips within a rapid period of time ( 2 second C/ T filming) by using a special CT technology ( Rapid Speed CT) . The Xavis Flip Chip in-line automatic testing device will revolutionarily contribute to the quality enhancement of your products. Subject of Testing: * MCP( Ball Grid Array)  A form of vertically stacking layers, as the degree of integration is difficult to heighten horizontally.  Generally used in methods that heighten the integration of dies that have identical forms.  Produced to overcome the restrictive reduction of elements ( minimum line width) * POP( Package on Package)  An MCP form method that connects chips by using joints etc.  A method that creates new packages by combining existing packages  A method developed within a short period of development time ( Chip Fusion Method) Main Functions  Application of various x-ray tubes ( 90KV, 100KV, 110KV)  Automatic CT Testing: The product is rotated at 360 degrees and filmed with a C/ T. The filmed data is automatically analyzed and good and faulty products are distinguished.  Testing Speed: Total testing speed - 2~ 10 seconds ( C/ T filming, analysis, result deduction)  Fields of Testing: Welding connection state testing within the chip, C/ T analysis testing  Release: The tray method is used to separate and release good and faulty products.