Detail XSCAN-7000
capacity for state-of-the-art a method of construction
matching function realization of high-accuracy
product detect capacity materialization of high speed
Know- How of automatic skill ( during 14 years)
Product Info
XSCAN-7000 is attachment automatic equipment. It can a fine point PCB product skill, STACK VIA, NMBI( Nero Manhattan Bump Interconnection) , Flip-Chip, BGA , etc that those are Aligh and attach.
Experience a life of efficiency make product by equipment suitable for advance a method of construction.
Applications
• Stack via
• NMBI ( Neo Manattan Bump Interconnection)
• PCB for Flip-Chip
• PCB for BGA
Main Features
• High Resolution Alignment ( 2› )
• Simulation for Re-Inspection
• Statistical Product Management
• Auto Calibration
• Closed-Type Tube
• Measurement / Analysis Software
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